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Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
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Quality of PCB Surface Finishes and Test Coupon Optimization
Minář, Jan ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface finishes, using a test coupon developed in cooperation with firm Gatema. It deals with surface finishes ENIG and immersion tin. For these samples deals with quality monitoring and periodic testing of these surface finishes. The solder using for tests is SAC305. Test methods are used for simulation of reflow soldering and wave soldering.
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Influence of Different Microetchants in Examination of Intermetallic Layers Morphology
Sčensný, Ľudovít ; Bayer, Robert (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis deals with the problematics of micro-etchants and their composition. The suitability of different solutions intended for observing morphology of intermetallic compounds in a soldered joint is examined. Three surface finishes coated with solder alloys are used to form representative samples. The prepared and processed samples in the form of a metallographic specimen are subsequently suitable for examining the microstructure of the etched surface. Laser scanning microscopy is used to analyse and evaluate morphology of the shown intermetallic compounds.
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Influence of printed board surface finishing on solderability with vapour soldering
Matras, Jan ; Starý, Jiří (referee) ; Šandera, Josef (advisor)
Thesis deals with vapor soldering and wetting the surface with solder during the soldering process. It describes in detail the advantages and disadvantages of various surface finishes on the PCB. Generally characterizes the properties of lead-free solders and fluxes. Describes vapor soldering process, including the properties of the liquid itself. It also focuses on a method of evaluating the wettability by using solder balls and its performance on individual samples surface finishes.
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Surface Finishes of Copper in PCBś Production
Bedlek, Marek ; Zatloukal, Miroslav (referee) ; Starý, Jiří (advisor)
This work examines and compares properties of different types of surface finishes, their qualities and shortcomings and perspective for future use. Emphasis is placed on new product in the field of OSP, Glicoat F2 from SHIKOKU CHEMICALS CORPORATION and immersion tin. It evaluates their influence on solderability and its changes after several reflow cycles and isothermal aging.
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WETTABILITY OF PCB SURFACE FINISHES
Minář, Jan ; Jana, Toulová (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis with measuring of wetting characteristics by the wetting balance method for samples of different surface finishes from the firm Gatema. It deals with influence of the isothermal aging and reflow processes on wetting characteristics of surface finishes ENIG, HAL and immersion tin. The influence of intermetallic layer on the overall wettability is studied in case of the surface finish of immersion tin. Also deals with the wettability of the nickel layer, after stripped off gold, in case of the surface finish of ENIG.
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Influence of Different Microetchants in Examination of Intermetallic Layers Morphology
Sčensný, Ľudovít ; Bayer, Robert (referee) ; Starý, Jiří (advisor)
This bachelor’s thesis deals with the problematics of micro-etchants and their composition. The suitability of different solutions intended for observing morphology of intermetallic compounds in a soldered joint is examined. Three surface finishes coated with solder alloys are used to form representative samples. The prepared and processed samples in the form of a metallographic specimen are subsequently suitable for examining the microstructure of the etched surface. Laser scanning microscopy is used to analyse and evaluate morphology of the shown intermetallic compounds.
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Quality of PCB Surface Finishes and Test Coupon Optimization
Minář, Jan ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This master’s thesis deals with measuring and evaluation of wetting for samples of different surface finishes, using a test coupon developed in cooperation with firm Gatema. It deals with surface finishes ENIG and immersion tin. For these samples deals with quality monitoring and periodic testing of these surface finishes. The solder using for tests is SAC305. Test methods are used for simulation of reflow soldering and wave soldering.
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Wettability of PCB Surface Finishes and Comparison of Methods
Vídeňský, Ondřej ; Přikryl, Tomáš (referee) ; Starý, Jiří (advisor)
This bachelor´s thesis deals with testing methods for surface finishe´s wettability PCB. For this tests has been designed and created testing board which contains testing coupons for testing methods. Boards have been created and covered by surface finishes by Gatema Boskovice. In this thesis electroless nickel with immersion gold (ENIG) and immersion tin have been tested. For simulation of reflow soldering have been used test methods solder indicator, solder spread test and dewetting test. Wetting balance test method has been used as simulation of wave soldering.
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